
陈存广
姓名:陈存广
所在系所:粉末冶金研究所
职称:研究员
通信地址:北京市海淀区学院路30号
邮编:100083
办公地点:金物楼223
办公电话:010-62334341
邮箱:cgchen@ustb.edu.cn
个人简介
研究方向
科研业绩
部分学术论文(第一/通讯作者):
[1] Shangxing Qiu#, Cunguang Chen#, Fang Yang*, Xin Li, Wei Gou, Binglu Zhang, Jingtao Su, Yang Li, Rui Wang, Wenqiang Yang, Xinyang Yu, Tieqiao Zhang, Zhimeng Guo, Tao Guo*, Xinhua Liu*. Synergistic strength and ductility achieved via dislocation-assisted coherent interface nucleation [J]. Acta Materialia, 2026, 313: 122277.
[2] Jingwei Guo, Guoping Su, Cunguang Chen*, Bingyu Zhang, Jingtao Su, Yang Li, Weihao Han, Fang Yang*, Xinhua Liu*. Achieving low quench sensitivity in Al-Zn-Mg-Cu alloy with ultra-high strength and plasticity prepared by powder metallurgy [J]. Journal of Alloys and Compounds, 2026, 1068: 188492.
[3] Chenyang Zhao, Cunguang Chen*, Lizhang Su, Guoping Su, Xin Li, Jiahao Guo, Yang Li, Fang Yang*, Xinhua Liu. Nanometer dual-phase dispersion strengthened aluminum resistant to ultrahigh-temperature softening [J]. Journal of Materials Research and Technology, 2026, 41: 900-912.
[4] Xin Li#, Weihao Han#, Cunguang Chen*, Yang Li, Miao Qi, Ren Zhang, Zhining Nie, Huimin Xia, Fang Yang*, Yang Ren, Xinhua Liu*, Zhimeng Guo. Synergistic enhancement of strength-ductility and fatigue crack propagation behavior in powder metallurgy Al-Cu-Mg alloy [J]. Materials Science & Engineering A, 2025, 944: 148909.
[5] Yang Li, Cunguang Chen*, Wei Sun, Miao Qi, Jie Yan, Changle Zhang, Han Liu, Yang Ren, Xinhua Liu*. Synergistic enhancement of strength-ductility in ODS copper alloy by exploring heterogeneous structure [J]. Materials Science & Engineering A, 2025, 931: 148194.
[6] Shangxing Qiu, Fang Yang*, Wanyu Wang, Shihao Chen, Ren Zhang, Wenqiang Yang, Yuping Dong, Wenjing Zhang*, Cunguang Chen*, Zhimeng Guo. Microstructural evolution and mechanisms for improved performance of powder metallurgy Ti-6Al-4V alloys after thermal deformation and heat treatment [J]. Journal of Alloys and Compounds, 2025, 1010: 178082.
[7] Miao Qi, Cunguang Chen*, Xin Li, Nenghui Xiao, Xingyuan Mei, Guoping Su, Fang Yang*, Xinhua Liu*, Zhimeng Guo. Microstructural evolution and dynamic mechanical behavior of PM 2195 Al-Li alloy with resistance to shear instability in high strain rate deformation [J]. Materials Science & Engineering A, 2024, 916: 147319.
[8] Chenzeng Zhang, Cunguang Chen*, Xinhua Liu, Mengjie Yan, Miao Qi, Xuecheng Li, Yang Li, Haifeng Zhang, Fang Yang*, Wenwen Wang, Zhimeng Guo. High strength and high electrical conductivity in Cu–Fe alloys with nano and micro Fe particles [J]. Materials Science & Engineering A, 2022, 856: 143948.
[9] Tianxing Lu, Cunguang Chen*, Pei Li, Chenzeng Zhang, Weihao Han, Yang Zhou, Challapalli Suryanarayana, Zhimeng Guo*. Enhanced mechanical and electrical properties of in situ synthesized nano-tungsten dispersion-strengthened copper alloy [J]. Materials Science & Engineering A, 2021, 799: 140161.
[10] Yang Li, Chuanbao Liu, Pei Li, Tianxing Lu, Cunguang Chen*, Zhimeng Guo, Yanjing Su, Lijie Qiao, Ji Zhou, Yang Bai*. Scattering cancellation by a monolayer cloak in oxide dispersion-strengthened alloys [J]. Advanced Functional Materials, 2020, 2003270.
部分发明专利(第一发明人):
[1] 一种高强高导自润滑弥散强化铜复合材料及制备方法,专利号:ZL 202411971363.X.
[2] 一种原位自润滑铝基电枢的制备方法和应用,专利号:ZL 202310283083.9.
[3] 一种高强高导自润滑铝基电枢的制备方法和应用,专利号:ZL 202310275643.6.
[4] 一种电铸制备钨弥散强化铜复合材料的方法,专利号: ZL 202111467319.1.
[5] 一种电铸制备高性能铜铁合金板带箔材的方法,专利号: ZL 202111467320.4.
[6] 一种3D冷打印制备电磁屏蔽用铜铁合金网的方法,专利号: ZL 202010512939.1.
[7] 一种短流程制备金属弥散强化铜的方法,专利号: ZL 201910549203.9.
[8] 一种高强高导减摩铜接触线的制备方法,专利号: ZL 201910550042.5.
[9] 一种高通量制备金属基复合材料的装置和方法,专利号: ZL 201810893195.5.
[10] 一种催化凝胶制备钨弥散强化铜基复合材料的方法,专利号: ZL 201810058339.5.